Outer Lead Bonding | Intelligent Process Equipment for Industry 4.0. Manufacturing | Shuz Tung
Outer Lead Bonding manufacturer. This equipment is primarily used for attaching anisotropic conductive film (ACF) onto LCD panels. It then utilizes a mold to punch out the driver IC from the TAB tape, aligns the I/O portion of the removed TAB with the previously attached ACF on the panel, and finally combines the TAB with the LCD panel using a thermal press head. Shuz Tung is a high-quality Outer Lead Bonding, OLB manufacturer from Taiwan since 1979. Shuz Tung Electronic Equipment Business Unit was established in 2001, focuses on the high-tech electronics equipment field, dedicated to the research and development, design, and manufacturing of automated production equipment and process inspection and measurement equipment. Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.
Outer Lead Bonding
OLB
This equipment is primarily used for attaching anisotropic conductive film (ACF) onto LCD panels. It then utilizes a mold to punch out the driver IC from the TAB tape, aligns the I/O portion of the removed TAB with the previously attached ACF on the panel, and finally combines the TAB with the LCD panel using a thermal press head.
Application Scope
- TFT-LCD & Touch Panel manufacturing equipment.
Features
Pre-Bonder- ACF on COF saves space and adopts a dual COF transmission system to improve efficiency.
- The protective film for the roll and waste material recycling are located in the same place for quick material replacement.
- Coupled with machine vision, it can instantly correct roll feeding errors, reducing setup time.
- Auxiliary pressure roller design overcomes panel warping.
- Short Bar bonding head allows independent settings for output and temperature.
- Bonding head with Auto Pitch function reduces setup time.
- Multiple sets of bonding heads can be installed.
Applications
Panel Size: Mainly 7" to 110"
Panel Thickness: 0.8 to 2.2mm
TCP Bonding Accuracy: X center : ≤ 5μm(3δ), Y center : ≤ 15μm(3δ), θ: ≤ 0.03° (3δ)
Tool Material: SUS630C
Temperature: RT ~ 500°C (1°C/step)
Punching Accuracy: ≤ 50μm(3δ)
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Outer Lead Bonding | Made in Taiwan Intelligent Process Equipment | Shuz Tung
Based in Taiwan since 1979, Shuz Tung Machinery Industrial Co., Ltd. is a manufacturer of intelligent process equipment. It's main intelligent process equipment include, Outer Lead Bonding, semiconductor automation equipment, semiconductor metrology and inspection equipment, flat panel display turnkey equipment, TFT-LCD module process whole line equipment and wafer shipper automatic packing and unpacking machines. We offer customized designs for optimal equipment efficiency in high-tech industries. Prioritizing speed of production, quality and environmental friendliness ensures competitive advantage and significant added value.
Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.
Shuz Tung has been providing customers with high quality intelligent process equipment since 1979, both with advanced technology and 30 years of experience, Shuz Tung ensures that each customer's needs are met.