Automatic Wafer Carrier Packing Equipment | Intelligent Process Equipment for Industry 4.0. Manufacturing | Shuz Tung

FOUP / FOSB Automatic Wafer Carrier Packing Equipment manufacturer. Automatic Wafer Carrier Packing is mainly used for wafer shipment and inter-factory transfer, which can save labor force, reduce work safety problems, improve wafer packaging quality, ensure the airtightness of wafer carrier packaging, and effectively reduce wafer fragments risks caused by manual operation. Wafer carriers (FOUP, FOSB), desiccant packet, humidity cards and customer labels can be vacuum sealed into specified bag types to meet customers' needs. Shuz Tung is a high-quality Automatic Wafer Carrier Packing Equipment, FOUP / FOSB Auto Packing Machine manufacturer from Taiwan since 1979. Shuz Tung Electronic Equipment Business Unit was established in 2001, focuses on the high-tech electronics equipment field, dedicated to the research and development, design, and manufacturing of automated production equipment and process inspection and measurement equipment. Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.