Automatic Wafer Carrier Unpacking Equipment | Intelligent Process Equipment for Industry 4.0. Manufacturing | Shuz Tung

Automatic Wafer Carrier Unpacking Equipment manufacturer. The packaged wafer carriers (FOUP, FOSB) can be separated from single or double layer bags, with the data read/reviewed at the same time according to customers' needs. It can replace labor cost, reduce manual unpacking errors, work safety problems, the risk of wafer fragmentation caused by human effectively, maintain product quality, and to meet the needs of intelligent production line. Shuz Tung is a high-quality Automatic Wafer Carrier Unpacking Equipment, Wafer Shipper, FOUP / FOSB Automatic Unpackaging System manufacturer from Taiwan since 1979. Shuz Tung Electronic Equipment Business Unit was established in 2001, focuses on the high-tech electronics equipment field, dedicated to the research and development, design, and manufacturing of automated production equipment and process inspection and measurement equipment. Established in 1979, with 43 years vast experience and resources in customized equipment manufacturing, and outstanding optical, mechanical, electronic, software, and system integration ability, Shuz Tung Machinery Industrial focuses on the core technologies, including Precision Mold Manufacturing, Laser Repair and Cutting, High Accuracy Bonding (PCB Bonder), Automatic Optical Inspection (AOI), Artificial Intelligence Imaging, and Turnkey Solution for Smart Manufacturing.